WebSAT facing EFTEC-64T raw material shortage crisis caused by the supplier (Furukawa) snow disaster resulting in plant shutdown. FURUKAWA is sole source for supply EFTEC-64T in whole world. There are 23 SEMTECH devices will be affected (Epoxy process), here is purpose to change the material from EFTEC-64T to CDA194. 2. Qualification Matrix http://media.futureelectronics.com/PCN/87162_SPCN.PDF

Effect of Cu based complexes on EFTECH 64 and C194 Cu alloy

WebTable 1 Surface roughness of the surface roughening treatment materials (the base material: EFTEC-64T-C, thickness: 0.125 mm). Roughening copper plating (Roughening height: 5 µm) Nickel roughening Etching Without roughening 10 µm 10 µm 10 µm 10 µm 5 µm 5 µm 5 µm 5 µm WebLead Frame Material: EFTEC-64T Terminal Surface Treatment: Solder (Pb free) plate HZ 0. 0 9 0. 2 0 1.00 12 13 24 36 25 37 48 7.00 9.00 9. 0 0 7. 0 0 1 1. 6 0 M A X 1. 4?< 0. 0 5 HZ 0. 0 5 0. 1 5 md shaiful islam parag

行业研究报告哪里找-PDF版-三个皮匠报告

WebFeb 25, 2013 · EFTEC-64T have been applied to achieve not only basic characteristics required for lead-frame materials but also excellent surface per for mance and high reliability. Table 1 shows the standard specifications. Two types of temper, 1/2H and H, have been specified to allow suitable selections depending on applications. Table 2 shows the WebEFTEC-64T EFTEC-64T See Pre and Post Change Summary for comparison. DAP Surface Prep Pd custom plating Ag on lead only Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve productivity by qualifying Ag on lead Die Attach Paddle (DAP) surface plating. Change Implementation Status: In Progress md shahriar hossain uq